Geraldine
Ferraro once said, that, “It was not so very long ago that people
considered that semi-conductors were part-time orchestra leaders &
microchips were very, very small snack foods”. It highlights the ingrained
ignorance in the common man towards technology and how much we lose due to it.
Surely, we’ve come a long way from that, however, it remains to be seen, how
much we can leap forward by leveraging today’s tech-savvy world.
Microcontrollers, a small computer on a metal-oxide-semiconductor
(MOS) integrated chip has revolutionized the world since the day it
was deployed. A typical microcontroller includes a processor, memory and
input/output (I/O) peripherals on a single chip. It is dedicated to a single
task and makes sure to complete that task efficiently. For example, a
microcontroller that is embedded in TV, executes the task of taking input from
the remote and displaying the output on the screen. Therefore, they are also
known as embedded systems. Now, if they are called as embedded
systems then a run-of-the-mill question that takes its head out is, What
are they embedded onto?
Microcontrollers Socket
A
simple answer to the question posed in the last line of the above passage is
PCB, which means Printed Circuit Board with the help of Microcontroller
Sockets. Microcontroller sockets, which are also known as IC sockets,
are used in the devices containing the integrated circuits and are used as a
placeholder for IC chips. The sockets are used for safe insertion and removal
of IC chips which may get damaged from soldering. These sockets are used in the
applications which require integrated circuit devices with short lead pins
helping in insertion and safely removal of IC chips. They are usually used in
prototyping the new circuits allowing easy component swapping.
There
are several variants of IC Sockets, such as dual-in line package
(DIP), quad-flat package (QFP), ball grid array (BGA), small outline packages
(SOP) and Small Outline IC (SOIC). There is tremendous amount of demand for the
microcontrollers socket, so much so, that the Microcontroller Socket
Market is expected to reach USD 1.46 billion by 2024,
according to a new report by Grand View Research, Inc.
Browse full research report on Microcontroller
Socket Market: https://www.grandviewresearch.com/industry-analysis/microcontroller-socket-market
What Varies In
The Variants?
The
above noted variants have several differences which makes them suitable to
cater to wide range of needs of embedded
systems.
- Dual-Inline
Package (DIP), also
known as DIL package or chip socket, is referred to as the electronic
device package with two parallel rows of electrical connecting pins and a
rectangular housing. An advantage of this system is that you can still see
the PCB traces which otherwise would be covered over by the socket frame.
In addition, airflow and thus thermal management is improved.
- Ball Grid
Arrays (BGAs) are
used for integrated circuits and area type of surface-mount packaging.
They are usually preferred for permanently mount devices such as
microprocessors and are not suited for socket mounting.
- The Quad
Flat Package (QFP) is a type of surface mount IC package which
has gull wing leads extending from the four sides. QFP is used to increase
the number of pins around the periphery of the package, which has led to a
decrease in spacing from 50 mil to 20 or 12 mil (thousands of an inch).
- Small
Outline Packages (SOP) is
a surface mount package, which is essentially the shrunk version of the
standard IC PDIP. The package thickness is typically 70% lesser than the
DIP and occupies an area of about 30-50% equivalent or lesser than the
DIP. It is majorly used in personal computers and consumer electronics.
The microcontroller socket
demand can be easily understood by the pie chart below, for which the data
considered was the application potential of the variant. The application areas
which were taken into consideration were consumer electronics, automotive,
industrial, medical devices and military & defense.
The
application areas which were taken into consideration were consumer
electronics, automotive, industrial, medical devices and military &
defense. Clearly, it highlights the dominance of Dual-Inline Package (DIP)
or chip socket over
other variants in the market.
Market
Determinants
Factors
that boost the growth or inhibits it are crucial for the demand in the market.
They can make or break the boom of the concerned sector.
- The growth
of automation which has led to the miniaturization, digitization, and
facilitates dynamics in the field of technology has further enhanced the
demand of the market.
- The increasing
need of providing high performance with power efficiency has
further led to the development of automation technology at a rapid pace.
- The increasing
labor costs and the growing demand for higher quality have encouraged
the industry participants to opt for automated equipment in the
programming process.
- The
increasing demand of sockets in the automotive, consumer electronics,
medical devices for more accurate data, and military &
defense for enhanced security has also encouraged the industry
participants to further reduce the package size.
- The
increasing IC packaging developments delivering a high application in
a low-cost, low-profile, and low-power design have led to the market
growth of integrated circuits. The competition in the industry is intense,
due to which the participants have to enhance their product quality and
process technologies as per the market requirements.
Aggressive
Advancements
Socket
manufacturers are developing enhanced designs for the purpose of
interconnecting solutions for high I/O, fine pitch, low profile applications,
and adhering to the severe regulations of performance and reliability. The key
industry competitors include Aries Electronics (U.S.), Mill-Max Mfg.
Corporation (U.S.), Samtec, Inc. (U.S.), and CNC Tech LLC (U.S.).
- AVNET, a
leading global technology solutions provider, has extended its
distribution agreement with Samtec, Inc. (U.S.). This
development provides Samtec, Inc, greater reach in Asia Pacific region and
will go on to boost its market potential.
- Samtec,
Inc., a leading provider of high bandwidth and micro-pitch
interconnect systems, announced today the acquisition of nMode
Solutions, of Oro Valley, Arizona. It also acquired Triton
Microtechnologies, which is the subsidiary of nMode Solutions.
nMode Smart Modules, RF filters, and evaluation boards support
the high-performance, high-density demands of the IC Packaging industry.
Utilizing Triton Microtechnologies patented Glass Core Technology,
nMode designers use the superior performance and material characteristics
of glass to achieve significant miniaturization and integration far beyond
what is possible with organic materials.
Browse request sample of this report by
Grand View Research: https://www.grandviewresearch.com/industry-analysis/microcontroller-socket-market/request/rs1
About Grand View Research
Grand View Research, Inc.
is a U.S. based market research and consulting company, registered in the State
of California and headquartered in San Francisco. The company provides
syndicated research reports, customized research reports, and consulting
services. To help clients make informed business decisions, we offer market
intelligence studies ensuring relevant and fact-based research across a range
of industries, from technology to chemicals, materials and healthcare.
For more info visit @ https://www.grandviewresearch.com
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